The Aluminum Heat Sink (150mm x 60mm x 25mm) is an extruded, high-efficiency passive cooling radiator engineered for high-power semiconductor devices, multi-channel audio amplifier ICs, linear power supplies, and LED arrays. Manufactured from high-purity aluminum alloy with densely spaced, high-aspect-ratio vertical cooling fins, this heat sink maximizes surface area contact with ambient air to facilitate rapid natural convection or forced-air heat dissipation. It provides a flat, rigid mounting platform capable of cooling multiple power devices simultaneously in industrial, automotive, and DIY audio electronics.

Specifications

• Product Type: Extruded Aluminum Passive / Forced-Air Heat Sink
• Material: High-Grade 6063-T5 Extruded Aluminum Alloy
• Finish / Surface Treatment: Natural Anodized / Matte Aluminum (Corrosion & Wear Resistant)
• Length: 150mm (5.9 inches)
• Width: 60mm (2.36 inches)
• Total Height / Thickness: 25mm (0.98 inches)
• Base Plate Thickness: Approx. 4.0mm to 5.0mm (Provides solid thermal mass and tapping depth)
• Fin Structure: Multi-Fin Vertical Extruded Array (Optimized for maximum convective surface area)
• Thermal Resistance: Approx. 1.2°C/W to 1.8°C/W (Natural Convection) / < 0>
• Mounting Base: Solid flat mounting surface (Easy to drill and tap for custom screw configurations)
• Compatible Devices: Multi-transistor TO-220, TO-247, TO-3P arrays, TDA/LM series monolithic amplifier ICs, SSR modules, and high-power LED arrays

Features

• Large Thermal Dissipation Surface: 150x60mm footprint with 25mm extended fin height provides extensive surface area to keep heavy-load power electronics running within safe thermal margins.
• Thick 4-5mm Solid Base Plate: Ensures rapid lateral heat spreading from localized semiconductor hotspots across the entire length of the cooling fins.
• High Mechanical Rigidity: Heavy-duty 6063-T5 aluminum structure resists warping and flexing under high mechanical clamping pressure or heavy module weight.
• Easy Custom Machining: Flat mounting surface can be drilled, tapped (e.g., M3 / M4 threads), or milled to accommodate custom transistor layouts and brackets.
• Versatile Cooling Compatibility: Functions effectively as a completely silent passive radiator or as an ultra-high-efficiency active cooler when paired with an external cooling fan.

Common Applications

• Audio Power Amplifiers: Cooling for monolithic amplifier ICs (e.g., TDA7294, TDA7293, LM3886, TDA2030/2050 arrays, and Class-D audio amplifier modules).
• High-Power Transistor Arrays: Multi-device thermal mounting for TO-220, TO-247, and TO-3P MOSFETs, IGBTs, and BJT output stages in linear power amplifiers.
• Linear & Switch-Mode Power Supplies (SMPS): Primary switching transistors and secondary rectifier diode heatsinking.
• Motor Drivers & CNC Controllers: Thermal management for stepper motor drives, DC speed controllers, and solid-state relays (SSRs).
• High-Power LED Fixtures: Thermal dissipation for 30W, 50W, and 100W COB LED arrays and grow light fixtures.

Usage Tips

• Thermal Interface Material (TIM): Always apply a thin, uniform layer of high-grade thermal paste (or use silicone thermal insulator pads) between the semiconductor mounting tab and the heatsink base to eliminate microscopic air gaps.
• Drilling & Tapping: When drilling custom mounting holes, use cutting lubricant (or isopropyl alcohol) and deburr the hole edges thoroughly to ensure the transistor mounts perfectly flat against the base.
• Fin Orientation: For passive cooling setups, orient the heat sink so the fins run vertically to maximize natural chimney-effect thermal airflow.
• Electrical Isolation: If mounting transistors with live metal tabs (such as the Collector/Drain), use appropriate mica/silicone insulators and nylon shoulder washers to prevent electrical shorting to the chassis.