BST-506 is a high purity alloy that is composed of 63% tin and 37% lead. BST-506 contains less oxides in the solder resulting improved flow. Sn63/Pb37 has a melting point of 183°C (361°F) which can be used in SMT, wave, selective and hand soldering processes. Its resistance to thermal fatigue makes it preferred for military and aerospace applications.

Specifications:

• Model: BST-506
• Melting point: 183 degrees Celsius
• Composition: Sn63/Pb37
• Granularity: 25-45um
• Storage conditions: 0-10 degrees Celsius (refrigerated) 
• Type: Lead-free solder paste
• Material: Alloy Powder