The 900M-T-I is an ultra-fine, needle-point conical soldering iron tip engineered for precision electronics work. Manufactured by GORDAK, this tip features a sharp, tapered apex with a tip radius of approximately 0.2mm. It is designed specifically for high-density surface mount technology (SMT), intricate micro-soldering, track repairs, and working under magnification where space is severely restricted.

Specification

• Brand / Series: GORDAK 900M Standard (Fully compatible with Hakko 936, Atten, Quick, Yihua, and Gordak 952/936A stations)
• Tip Profile: Type I (Ultra-Fine Conical / Needle Point)
• Tip Radius / Point Size: Approx 0.2mm
• Core Material: High-Conductivity Pure Oxygen-Free Copper (OFC)
• External Protective Layering: Multi-layer electroplating (Thick iron matrix, structural nickel, corrosion-resistant chromium, and pre-tinned tip)
• Heating Element Fit: Internal-heat hollow sleeve (Designed for ceramic heating elements measuring approx 4mm outer diameter)

Features

• Ultra-Fine Needle Precision: The micro-sharp point allows users to pinpoint tiny components like 0402 and 0201 resistors without accidentally touching or melting adjacent components on crowded circuit boards.
• Multi-Layer Electroplated Matrix: Encased in a uniform iron-plating layer that slows down the pitting and hollowing effects caused by aggressive flux acids, protecting the core copper body underneath.
• Chromium Non-Wetting Body Shroud: The rear shaft is treated with a chromium coating. Solder cannot adhere to this area, preventing molten solder from traveling up the shaft and forcing it to stay pooled at the very tip.
• Low Heat Retention Profile: Because the tip tapers to a fine point, it has very low thermal mass. This design prioritizes positional accuracy over raw power transmission, making it perfect for delicate logic traces.

Common Applications

• Smartphone & Logic Board Micro-Soldering: Repairing broken pads, jumping micro-wires (bodge wires) on iPhone or Android logic boards, and refitting tiny SMD components.
• FPC Connector & Ribbon Repairs: Soldering high-density Flexible Printed Circuit (FPC) connectors on display screens and camera modules.
• Micro-Controller Pin Touch-ups: Clearing fine solder bridges between high-pin-count microchip legs (e.g., QFP or SOIC chips) under a microscope.
• Intricate Hobbyist Electronics: Soldering fine jewelry wires, micro-LED matrices, or delicate drone sensor pins.

Professional Usage & Maintenance Tips

• Compensate for Low Thermal Mass: Because Type-I tips have very little copper at the point, they lose heat instantly upon touching a cold PCB plane. Do not force the tip down harder to make it melt solder. Pushing down will bend or snap the fine needle point. Instead, increase your station's temperature slightly (approx 10℃ - 20℃  higher than usual, up to 350℃ - 360℃ or use a tiny blob of solder on the tip to create a thermal bridge.
• Avoid High Heat Degradation: Do not leave your iron idling at temperatures above 380℃ on your stand. Because the tip is incredibly thin, high heat combined with ambient oxygen will bake the flux residues into a black, glassy layer of oxidation within minutes, making the tip completely push away solder (non-wetting).
• Clean Exclusively with Brass Wire: Avoid wiping this fine tip aggressively against wet cellulose sponges. The rapid thermal shock can cause micro-fractures in the iron plating. Use a brass wire cleaning mesh to gently dislodge debris without pulling down the tip's temperature.
• Sacrificial Tinning for Storage: Always coat the tip with a fresh, generous bead of solder before switching off your soldering station. This sacrificial layer shields the micro-thin iron plating from air exposure while cooling down, preventing oxidation.