Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface. u

Provide a mess-free installation, maximum heat conduction, and increased cooling. Reduce the effectiveness of your heatsink and raise the operating temperature of your processor or video card.

Features:

• Material: conduction silicone
• Thermal Conductivity: 3.2
• (W/M-K) Continuous Temperature: -40 Celsius degree~200 Celsius degree
• Breakdown Voltage: >4KV
• Tensile Strength: 180 kg/cm2
• Color: Blue
• Size: 100 x 100 x 0.5 mm

Applications:

• The control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes, LED IC SMD DIP, and any cooling module need to be filled with materials for electrical and electronic products.