The HM706 Heat-Sink Compound is a premium thermal paste designed to enhance heat dissipation between electronic components and heat sinks. With high thermal conductivity and easy application, it ensures efficient cooling, helping to maintain device performance and extend component lifespan. Ideal for CPUs, GPUs, power transistors, and other heat-generating electronics.

Key Features:

• High thermal conductivity for effective heat transfer
• Reduces operating temperature of electronic components
• Easy-to-apply paste for precise and clean application
• Non-corrosive and electrically non-conductive
• Long-lasting performance under continuous operation
• Supplied in a convenient tube for controlled dispensing

Specifications:

• Model: HM706
• Type: Thermal Paste / Heat-Sink Compound
• Form: Paste
• Thermal Conductivity: High (specific value depends on batch)
• Viscosity: Medium, suitable for easy application
• Colour: Gold
• Package: Tube

Applications:

• CPUs and GPUs in computers and laptops
• Power transistors, voltage regulators, and LED modules
• Heat sinks for electronic and industrial devices
• DIY electronics and hobby projects
• High-performance electronic cooling solutions