The Maxtor MT-1202 Heat-sink Compound Thermal Paste Grease is an industrial-grade thermal interface material (TIM) engineered to bridge microscopic air gaps between heat-generating electronic components and heatsinks, cold plates, or metal chassis enclosures. Formulated with high-purity thermally conductive ceramic metal-oxide fillers suspended in a stable high-temperature synthetic silicone fluid, it provides reliable heat transfer, low thermal contact resistance, and dielectric insulation. Because it is a non-curing, non-drying compound, it maintains a stable paste consistency across an operating temperature range of -40°C to +200°C without cracking, running, or drying out, making it suitable for high-power LED arrays, power supply semiconductor modules, CPU/GPU cooling, and automotive electronics.

Specifications

• Brand / Model: Maxtor MT-1202 (Industrial Thermal Grease Series)
• Chemical Base: High-Temperature Synthetic Silicone Fluid with Thermally Conductive Oxide Fillers
• Appearance / Color: Brilliant White Homogeneous Paste
• Curing State: Non-Curing / Non-Drying (Maintains elastic paste state over service lifetime)
• Thermal Conductivity (k): 1.0 ± 0.2 W/m·K
• Specific Gravity / Density: 1.6 ± 0.08 g/cm³ (at 25°C)
• Cone Penetration: 420 ± 10 (1/10 mm at 25°C)
• Dielectric Breakdown Voltage: > 5.0 kV/mm
• Electrical Conductivity: Electrically Non-Conductive / Dielectric Insulator
• Volatile Loss / Evaporation Rate (V_daf): < 1>
• Operating Temperature Range: -40°C to +200°C
• Peak / Limit Temperature Tolerance: -50°C to +250°C (Short-term thermal excursion)
• Bleed / Oil Separation: ≤ 1.5% (at 150°C for 24 Hours)
• Environmental Compliance: RoHS Compliant, Non-Corrosive, Non-Toxic

Features

• Non-Curing & Non-Drying Formula: Never hardens, bakes, or flakes, allowing easy component removal, re-application, and field servicing without scraping hard residue.
• High Dielectric Breakdown Strength (>5.0 kV/mm): High electrical insulation properties eliminate the risk of short-circuits when applied around exposed PCB traces, solder pins, and component leads.
• Low Thermal Interface Resistance: Displaces insulating micro air pockets between mating metal surfaces to establish an uninterrupted heat conduction path.
• Broad Temperature Stability (-40°C to +200°C): Retains optimal viscosity and thermal dissipation efficiency under continuous high-temperature loads and extreme thermal cycling.
• Surface Wetting Capability: Spreads uniformly under heatsink clamp pressure to cover large surface areas like LED aluminum PCBs and multi-pin power semiconductor tabs.

Common Applications

• High-Power LED Modules: Interfacing aluminum metal-core PCBs (MCPCB) of COB and SMD high-power LED fixtures to external extruded aluminum heatsinks.
• Power Electronics & SMPS: Mounting TO-220, TO-247, and TO-3 power MOSFETs, IGBTs, bridge rectifiers, and voltage regulators onto heatsink fins.
• Audio Amplifiers & Inverters: Heat dissipation for high-power audio output transistors, DC-AC solar inverters, and motor drive controllers.
• Computing & Embedded Systems: Thermal interface for desktop CPUs, GPU chipsets, Northbridge/Southbridge chips, and single-board computers (Raspberry Pi, industrial SBCs).
• Automotive & Industrial Equipment: Sensor modules, thermistors, automotive ECUs, and industrial process control units requiring thermal stability.

Usage Tips

• Surface Preparation (MANDATORY): Thoroughly clean both mating surfaces (the component package and the heatsink base) using Isopropyl Alcohol (IPA ≥ 99%) and a lint-free cloth. Ensure surfaces are free from dust, manufacturing oils, and old thermal paste residues before applying new grease.
• Application Thickness Guideline ("The Thinner, The Better"):
  • Thermal paste has lower thermal conductivity than direct copper or aluminum contact; its only function is to fill microscopic air voids.
  • Apply only a thin, uniform film using a plastic spatula, spreader card, or flat applicator. Applying an excessively thick layer acts as a thermal insulator and will reduce cooling efficiency.
• Mechanical Clamping: Always secure the heatsink using adequate, balanced spring clamp or screw tension. Proper mounting pressure forces excess grease out to the edges and minimizes thermal layer thickness.
• Silicone Oil Separation: During long-term storage, a small layer of clear silicone oil may naturally separate on the top surface. This is normal; simply stir and mix the paste thoroughly before application.
• Storage Recommendations: Store the container tightly sealed in a cool, dry area away from direct sunlight and heat sources to ensure long shelf life.