Specifications:

• Solderless Breadboard - 830 Tie Points consists of: 630 Tie-Point Terminal Strip, 200 Tie-Point Distribution Strips.
• 126 separate 5 point terminals, plus 4 horizontal bus lines (Power Lines) of 50 test points each.
• Each point is identified with letters across the top and number down the side
• Accepts most electronic components, including integrated circuits and transistors for digital and/or analog circuitry
• Component lead bender for easier insertion
• Pins are identified by numbered rows and columns
• Use to breadboard and debug circuit designs
• Low static, plastic body
• Designed for 5000 insertions per point
• Breadboard size : 165mm (L) x 55mm (W)