This solderless breadboard with 400 tie points is specifically designed for Arduino shield prototyping and testing, as it allows makers to experiment with their circuitry before committing to a certain design or layout of connections. With a solderless breadboard, makers can simply utilize jumpers to connect up various components and test out the circuits before they solder parts or wires together, allowing for seamless iteration and enhancement.

This breadboard has 400 total tie-points, with 300 of these being standard points in the middle lanes. 100 of these tie-points, however, are divided into the side lanes, each containing five sets of ten power tie-points.

Specifications:

• Amount of Tie-Points: 400 Total
• Standard Tie-Points: 300 in Double-Strip (Middle Lanes)
• Power Lane Tie-Points: 100 (50 in each Power Lane) along edges
• Recommended Voltage: 300V
• Recommended Current: 3-5A
• Wire Diameter Compatibility: 20-29 AWG
• Dimensions:  8.2 cm x 5.5 cm x 0.85 cm