Features:

• Narrow body SOIC 8-lead package
• Low power operation
• 5V operation
• 1.1 mA per channel maximum @ 0 Mbps to 2 Mbps
• 3.7 mA per channel maximum @ 10 Mbps
• 8.2 mA per channel maximum @ 25 Mbps
• 3V operation 0.8 mA per channel maximum @ 0 Mbps to 2 Mbps
• 2.2 mA per channel maximum @ 10 Mbps
• 4.8 mA per channel maximum @ 25 Mbps
• Bidirectional communication
• 3V/5V level translation
• High temperature operation: 105°
• High data rate: dc to 25 Mbps (NRZ)
• Precise timing characteristics
• 3 ns maximum pulse-width distortion
• 3 ns maximum channel-to-channel matching
• High common-mode transient immunity: > 25 kV/us
• Safety and regulatory approvals
• UL recognition
• 2500 V rms for 1 minute per UL 1577
• CSA component acceptance notice #5A
• VDE certificate of conformity
• DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
• DIN EN 60950 (VDE 0805): 2001-12; DIN EN 60950: 2000
• VIORM = 560 V peak

APPLICATIONS:

• Size-critical multi channel isolation
• SPI interface/data converter isolation
• RS-232/RS-422/RS-485 transceiver isolation
• Digital field bus isolation