The HY910 High-Performance Thermal Conductive Adhesive Glue is a specialized, one-part room-temperature vulcanizing (RTV) silicone-based thermal bonding compound engineered for heat sink attachment and thermal management in electronics. Formulated with high-purity metal oxide fillers and synthetic silicone fluid, it combines high thermal conductivity (> 0.975 W/m-K) with robust mechanical bonding strength and high electrical insulation. It cures upon exposure to atmospheric moisture to form a resilient, elastomeric layer that permanently adheres heat sinks to high-power components without requiring screws, mechanical clips, or thermal tape. It is widely used for bonding aluminum heat sinks to high-power LEDs, MOSFETs, GPU/CPU VRMs, motor driver ICs, solid-state relays, and power supply components.

Specifications

• Model / Part Number: HY910 (HY-910 Thermal Conductive Plaster / Glue)
• Chemical Base: One-Component Moisture-Curing RTV Silicone Elastomer
• Appearance / Color: White Viscous Paste / Liquid
• Thermal Conductivity: > 0.975 W/m-K (Typ. 0.975 to 1.1 W/m-K)
• Thermal Impedance / Resistance: < 0>
• Specific Gravity / Density: 2.3 g/cm³ to 2.5 g/cm³ (at 25°C)
• Viscosity / Flowability: Thixotropic Non-Flowing Paste (High slump resistance)
• Tensile Shear Bonding Strength: ≥ 1.5 MPa to 2.0 MPa (Strong permanent bond on aluminum/copper)
• Dielectric Breakdown Voltage: ≥ 10 kV/mm (High electrical insulation)
• Dielectric Constant: 5.1 (at 100 Hz)
• Dissipation Factor: < 0>
• Volume Resistivity: ≥ 1.0 × 10¹⁴ Ω·cm
• Operating Temperature Range: -60°C to +200°C (Short-term peak up to +250°C)
• Tack-Free / Initial Set Time: 10 to 15 minutes (at 25°C, 55% Relative Humidity)
• Full Curing Time: 24 hours (for 2mm–4mm adhesive bead at room temperature)
• Packaging: Hermetically sealed squeezable metal tube (Typ. 5g / 10g net weight)

Features

• Dual Function Thermal Bonding: Acts simultaneously as a high-efficiency thermal interface material (TIM) and a high-strength permanent structural adhesive, eliminating mechanical mounting hardware.
• High Thermal Dissipation: Metal oxide thermal matrix efficiently fills microscopic surface voids between semiconductors and heat sinks, minimizing thermal interface resistance.
• High Dielectric Isolation: Fully non-conductive electrically, preventing short circuits when applied across exposed PCB traces, component leads, or IC packages.
• Wide Temperature Resilience: Maintains elastomeric flexibility and bonding strength from -60°C to +200°C without cracking, drying out, or thermal oil bleeding.
• Vibration & Shock Resistant: Flexible silicone rubber matrix absorbs mechanical shock and thermal expansion differences between aluminum heat sinks and silicon dies.

Common Applications

• High-Power LED Modules: Permanently bonding 1W, 3W, 5W, 10W, and COB LED star aluminum PCBs to large external heatsink plates.
• Power Electronics & Motor Drivers: Attaching miniature aluminum heatsinks onto stepper driver ICs (A4988, TMC2209, DRV8825), linear regulators (LM7805, LM317), and power MOSFETs.
• PC & Graphics Card Cooling: Fastening secondary heatsinks onto GPU VRM MOSFETs, VRAM memory chips, and motherboard southbridge/northbridge chipsets.
• Solid-State Relays (SSRs) & Inverters: Thermal coupling between SSR metal baseplates and chassis enclosures.
• Raspberry Pi & Router SOCs: Attaching adhesive heatsinks onto Broadcom SOCs, RAM chips, and network switch controllers.

Usage Tips

• Surface Preparation (Critical): Clean both the component package and heat sink surface thoroughly with **Isopropyl Alcohol (IPA ≥ 99%)** to remove oils, dust, or old thermal paste residues. Ensure surfaces are completely dry before application.
• Thin Layer Application: Thermal conductivity is highest with the thinnest possible adhesive layer. Apply a small dot or thin film (approx. **0.1mm to 0.2mm thick**) to the center of the surface, press the heatsink firmly with a slight twisting motion to squeeze out air bubbles, and wipe away excess glue from the edges.
• Clamping & Curing: The adhesive skins over in 10–15 minutes but requires **24 hours at room temperature** to achieve full tensile bonding strength and thermal stabilization. Apply light pressure or clamping for the first 1–2 hours.
• Permanent Bonding Warning: HY910 forms a **permanent mechanical bond**. Do not use it on components where you plan to remove or swap the heatsink later (for temporary setups, use standard thermal paste with clips or double-sided thermal tape instead).
• Storage & Preservation: Immediately recap the tube tightly after dispensing. Exposure to ambient air will cause the remaining adhesive inside the nozzle to cure. Store in a cool, dry place below 25°C.