The Original 5mm Blue Water Clear LED (Production Quality - Pack of 1000 Pcs) is an ultra-bright, commercial-grade through-hole light-emitting diode engineered for high-volume PCB manufacturing, optical signaling, and direct illumination. Encapsulated in a standard T-1 3/4 (5mm) crystal-clear water-clear epoxy resin lens, it integrates a high-efficiency InGaN (Indium Gallium Nitride) semiconductor die that emits a focused, intense 460nm–470nm royal blue beam with a narrow 20° to 30° viewing angle. Built with pure copper leadframes for superior thermal dissipation and high-integrity internal gold-wire bonding, these LEDs deliver exceptional optical punch, high luminous efficacy, and tight batch-to-batch electrical consistency across the entire 1000-piece production pack. They are widely utilized in optical sensors, high-brightness status beacons, daylight-readable signage, decorative illumination, and DIY electronics projects.

Specifications

• Product Type: 5mm (T-1 3/4) Blue Water Clear Through-Hole LED (Pack of 1000 Pieces)
• Lens Type / Appearance: 5mm Round Water Clear Transparent Epoxy Lens
• Emitted Light Color: Blue
• Dominant Wavelength (λd): 460 nm to 470 nm (Peak Wavelength λp ≈ 465 nm)
• Semiconductor Material: InGaN (Indium Gallium Nitride on Sapphire Substrate)
• Luminous Intensity (Iv): 5,000 mcd to 10,000 mcd (at IF = 20mA, high-intensity focused beam)
• Viewing Angle (2θ1/2): 20° to 30° (Narrow-angle directional spotlight emission)
• Forward Voltage Drop (VF): Typ. 3.0V / Range 2.8V to 3.4V (at IF = 20mA)
• Continuous Forward Current (IF): 20mA (Nominal) / Max. 30mA (Absolute Maximum)
• Peak Pulse Forward Current (IFP): Up to 100mA (1/10 Duty Cycle, 0.1ms Pulse Width)
• Reverse Breakdown Voltage (VR): Min. 5.0V (at IR = 10µA)
• Reverse Leakage Current (IR): Max. 10µA (at VR = 5V)
• Power Dissipation (Pd): 100mW (at Ta = 25°C)
• Electrostatic Discharge (ESD) Threshold: Up to 2000V (HBM)
• Lead Pitch / Spacing: Standard 2.54mm (0.1-inch)
• Lead Material & Plating: Pure Copper Alloy with Tin/Silver Electroplating for High Solderability
• Polarity Identification: Longer Lead: Anode (+), Shorter Lead & Flat Lens Rim: Cathode (-)
• Operating Temperature Range (Topr): -40°C to +85°C
• Storage Temperature Range (Tstg): -40°C to +100°C
• Lead Soldering Temperature: 260°C for max. 3 to 5 seconds (at 2mm distance from epoxy base)

Features

• Water Clear Narrow-Beam Optics: Crystal-clear lens focuses emitted light into a tight 20°–30° beam, concentrating luminous intensity up to 10,000 mcd for long-range optical visibility and direct spot signaling.
• Production-Grade Batch Consistency: Strict automated binning ensures uniform forward voltage (VF ~3.0V), pure royal blue chromaticity (465nm), and luminous output across all 1000 units.
• High-Conductivity Copper Leads: Thick copper alloy leadframes provide efficient thermal conduction away from the semiconductor die, preventing thermal degradation and extending operational life.
• High Luminous Efficacy: Advanced InGaN die delivers intense brightness even at lower drive currents (5mA–10mA) to conserve battery power in portable devices.
• Universal 2.54mm DIP Pitch: Standard T-1 3/4 form factor fits seamlessly into solderless breadboards, stripboards, automated PCB insertion machines, and panel-mount LED clips.

Common Applications

• High-Visibility Indicators: Long-distance Bluetooth/wireless link indicators, power status lights, and custom panel annunciators.
• Optical Sensing & Photo-interrupters: Focused light emitter for optical edge sensors, slot sensors, and speed encoder disks.
• Decorative & Accent Illumination: Mini spotlights, PC case modding, backlighting for acrylic signs, and decorative displays.
• Automotive & Motorcycle Accents: Instrument gauge needle lighting, dashboard accents, and custom auxiliary indicators.
• DIY Robotics & Microcontroller Projects: High-impact visual feedback and headlights on Arduino, ESP32, Raspberry Pi, and STM32 platforms.

Usage Tips

• Always Use a Current-Limiting Resistor: **Never connect the LED directly across a voltage source without a series current-limiting resistor**, as unconstrained current will destroy the internal LED die immediately.
• Series Resistor Calculation Formula: R_series = (Vsupply - VF) / IF.
  • From a +5.0V Logic Rail (at IF = 15mA, VF = 3.0V): R = (5.0V - 3.0V) / 0.015A = 133Ω (Standard 150Ω or 220Ω, 1/4W resistor recommended).
  • From a +12.0V Supply (at IF = 15mA, VF = 3.0V): R = (12.0V - 3.0V) / 0.015A = 600Ω (Standard 560Ω or 680Ω, 1/4W resistor recommended).
  • From a +24.0V Industrial Rail (at IF = 15mA, VF = 3.0V): R = (24.0V - 3.0V) / 0.015A = 1400Ω (Standard 1.5kΩ, 1/2W power resistor recommended).
• Polarity Identification: Connect the longer lead to the positive rail (Anode +) and the shorter lead to ground or the low-side switch (Cathode -). If leads are already trimmed, the Cathode side is identified by the flat notched edge on the rim of the epoxy base.
• 3.3V Microcontroller Interfacing: Because the blue InGaN LED forward drop is ~3.0V, driving directly from a 3.3V GPIO rail leaves only ~0.3V across the series resistor. Use a small 22Ω to 47Ω resistor for direct low-current driving (5mA–8mA), or drive via an NPN transistor (e.g., 2N2222/BC548) connected to a 5V rail for maximum brightness.
• Soldering Recommendations: Keep a minimum clearance of 2mm between the soldering iron tip and the bottom of the epoxy body. Limit soldering contact time to under 3–5 seconds at 260°C to protect the internal gold bonding wire from thermal stress.