The Solder Wire Lead Roll 63/37 0.8mm 100g High Quality is an extended-capacity spool of true eutectic tin-lead alloy soldering wire engineered for production-line electronics assembly, professional PCB rework, wire harness fabrication, and continuous benchtop repair. Formulated with an exact metallurgical ratio of 63% Tin (Sn) and 37% Lead (Pb), it features a sharp, singular eutectic melting transition at exactly 183°C (361°F), completely bypassing the semi-solid "pasty range" during solidification. Centered along its versatile 0.8mm diameter is a continuous, high-grade activated rosin flux core that delivers instantaneous wetting, rapid capillary spread, and mirror-bright, concave solder joints with high mechanical and electrical reliability.

Specifications

• Alloy Composition: 63% Tin (Sn) / 37% Lead (Pb) (True Eutectic Formulation)
• Wire Diameter Gauge: 0.8 mm (Approx. 0.031 Inches / Ideal balance for SMD and THT)
• Net Alloy Weight: 100 g (Excluding spool tare weight)
• Quality Standard: High Quality (High-purity virgin alloy with consistent flux core continuity)
• Melting Characteristics:
  • Eutectic Melting Point: Exactly 183°C (361°F)
  • Solidus Temperature: 183°C
  • Liquidus Temperature: 183°C
  • Pasty Range: 0°C (Transitions instantly from liquid to solid without intermediate plastic phase)
• Flux Core Type: High-Grade Activated Rosin Core (RA / RMA Type, Non-Corrosive)
• Flux Content / Percentage: 1.8% to 2.2% Core by Weight
• Flux Halide Content: < 0>
• Solder Joint Appearance: Mirror-Bright, Shiny, and Smooth Concave Fillet
• Residue Characteristics: Amber/Clear, Non-Conductive, and Non-Corrosive Rosin Residue
• Spool Construction: High-Impact Rigid Thermoplastic Reel with Smooth De-Reeling Arbor
• Spool Dimensions: Approx. 54 mm Flange Diameter × 28 mm Height (Arbor hole: ~19 mm to 20 mm)
• Gross Weight: Approx. 115 g to 130 g (Wire and spool combined)

Features

• True Eutectic Solidification: Freezes instantly upon cooling past 183°C, eliminating disturbed or crystalline cold joints caused by slight component movement during cooling.
• Extended 100g Production Spool: Provides double the wire capacity of standard 50g hobby spools, minimizing reel changes on busy technician benches and assembly stations.
• Versatile 0.8mm Wire Gauge: Delivers the optimal solder volume per millimeter for through-hole DIP ICs, passive components, terminal blocks, pin headers, and medium SMD footprints (1206/0805).
• Instant Wetting & Capillary Flow: High-purity tin-lead alloy combined with an active rosin core strips surface oxidation from copper pads, brass pins, and tinned leads in under a second.
• Non-Corrosive High-Impedance Residue: Dries into an inert, non-conductive rosin shield with high surface insulation resistance (SIR), safe to leave on standard commercial boards without fear of trace degradation.
• Low Spatter & Minimal Fuming: Carefully formulated flux core minimizes popping, solder spatter, and micro-balling during rapid thermal contact, keeping the surrounding PCB clean.

Common Applications

• Through-Hole PCB Assembly: Hand-soldering DIP integrated circuits, pin headers, terminal blocks, radial/axial capacitors, and discrete passive components.
• High-Volume Bench Repair & Rework: Daily maintenance and component replacement in electronics repair shops, audio gear service centers, and R&D laboratories.
• Cable & Wire Harness Assembly: Tinning stranded copper conductors, soldering automotive/marine wiring harnesses, and securing DC barrel jacks.
• Robotics & Drone Prototyping: Securing battery leads (XT60, Deans), electronic speed controller (ESC) power pads, and brushless motor leads.
• Educational STEM & Maker Prototyping: Circuit fabrication on copper-clad protoboards, stripboards, and point-to-point wiring projects.

Usage Tips

• Iron Temperature Calibration:
  • Due to the low eutectic melting point of 183°C, set your soldering iron tip between 300°C and 340°C (572°F to 644°F).
  • Avoid running the iron above 360°C; excessive heat rapidly burns away the rosin flux before it can deoxidize the joint, leaving oxidized, frosty surfaces.
• Proper Soldering Sequence:
  • Touch the tinned iron tip simultaneously to the component lead and the PCB copper pad to heat both parts for 1 to 2 seconds.
  • Feed the 0.8mm solder wire directly into the heated joint—not directly onto the iron tip. Once the solder flows smoothly around the lead to form a shiny concave fillet, withdraw the wire first, then cleanly lift the iron tip away.
• Residue Cleaning (Optional): While the rosin flux residue is non-conductive and chemically non-corrosive under normal operating conditions, clean sensitive RF, high-impedance analog, or high-voltage circuits using an ESD-safe brush and Isopropyl Alcohol (IPA ≥ 99%).
• Health & Environmental Safety:
  • Contains elemental lead (Pb). Always wash hands thoroughly with soap and water after handling solder wire, and never eat or drink near the soldering workbench.
  • Work in a well-ventilated space or use an active benchtop solder fume extractor to pull rosin flux smoke and airborne particulate away from your breathing zone.
• Spool Holder Mounting: The center arbor hole fits standard desktop soldering iron stand reel spindles, allowing smooth, snag-free wire feeding with one hand during assembly.