The HM501 Heat-Sink Compound is a high-performance thermal paste designed to enhance heat transfer between ICs, power transistors, and heat sinks. Its excellent thermal conductivity ensures efficient cooling, improving device performance and longevity. Easy to apply, it provides long-lasting and reliable thermal management for electronic components.

Key Features:

• High thermal conductivity for effective heat transfer
• Reduces operating temperature of electronic components
• Easy-to-apply paste for precise application
• Non-corrosive and electrically non-conductive
• Long-lasting performance under continuous operation
• Comes in a convenient tube for controlled dispensing

Specifications:

• Model: HM501
• Type: Thermal Paste / Heat-Sink Compound
• Form: Paste
• Thermal Conductivity: High (exact value varies by batch)
• Viscosity: Medium, easy to apply
• Colour: Grey

Applications:

• Power transistors and voltage regulators
• LED modules and high-power electronics
• Heat sinks and cooling solutions for DIY projects
• Industrial and consumer electronic devices