The IXFH90N30T is a high-power, high-current N-Channel TrenchT2™ Power MOSFET manufactured by IXYS (Littelfuse) and housed in a heavy-duty TO-247AD through-hole package. Engineered to deliver extremely low on-state resistance (R_DS(ON)), high avalanche energy ruggedness, and fast switching performance, the IXFH90N30T features a drain-source breakdown voltage rating of 300V and a continuous drain current capacity of 90A. It is widely used in high-frequency switch-mode power supplies (SMPS), DC-DC converters, battery chargers, motor speed controllers, and uninterruptible power supplies (UPS).

Specifications

• Brand / Manufacturer: IXYS / Littelfuse
• Part Number: IXFH90N30T
• Transistor Type: N-Channel Power MOSFET (TrenchT2™ Technology)
• Drain-Source Breakdown Voltage (V_DSS): 300V
• Gate-Source Voltage (V_GSS): ±20V (Continuous) / ±30V (Transient)
• Continuous Drain Current (I_D25): 90A (at T_C = 25°C)
• Pulsed Drain Current (I_DM): 230A (at T_C = 25°C, pulse width limited by T_JM)
• Static Drain-Source On-Resistance (R_DS(ON)): < 33m>GS = 10V, I_D = 45A)
• Gate Threshold Voltage (V_GS(th)): 3.0V to 5.0V (at I_D = 1mA)
• Total Gate Charge (Q_g): Approx. 135nC (at V_GS = 10V, V_DS = 150V, I_D = 45A)
• Single Pulse Avalanche Energy (E_AS): Up to 1.5J (at I_A = 45A)
• Maximum Power Dissipation (P_D): 780W (at T_C = 25°C)
• Operating Junction & Storage Temperature Range: -55°C to +175°C
• Package / Case: TO-247AD (3-Pin Through-Hole: Pin 1: Gate, Pin 2: Drain, Pin 3: Source, Mounting Tab: Drain)

Features

• TrenchT2™ Technology: Provides ultra-low R_DS(ON) to substantially reduce conduction losses and minimize thermal generation under high continuous currents.
• High Current Handling (90A continuous / 230A pulsed): Ideal for demanding primary-side switching stages and high-power DC distribution buses.
• High Operating Junction Temperature (175°C): Offers extended thermal headroom and reliable operation in heavy-duty industrial power environments.
• Avalanche Energy Ruggedness: 100% avalanche tested to survive transient inductive energy spikes without breakdown failure.
• Heavy-Duty TO-247 Package: Large thermal mounting tab provides superior heat transfer down to a low junction-to-case thermal resistance (R_thJC ≈ 0.19°C/W).

Common Applications

• High-Power DC Motor Controllers: Primary switching stages for high-voltage DC motors and brushless DC (BLDC) drives.
• High-Frequency SMPS & Resonant Inverters: High-efficiency switching in solar inverters, telecom rectifiers, and industrial power units.
• Battery Management & High-Current Disconnect: Solid-state battery switches and master disconnect relays for 48V to 150V battery banks.
• DC-DC Buck & Boost Converters: Synchronous rectification and primary power switching in high-wattage power supplies.
• Uninterruptible Power Supplies (UPS) & Welding Inverters: Primary power stage switching in heavy-duty inverter topologies.

Usage Tips

• Dedicated Gate Driver IC: Because of the high gate charge (Q_g ≈ 135nC), drive the gate with a high-current driver (e.g., IXDD609, TC4420, or IR2110) supplying a solid 12V to 15V gate signal to ensure fast switching and eliminate thermal runaway.
• Gate Resistor & Pull-Down: Install a 4.7Ω to 15Ω resistor in series with the Gate (Pin 1) to eliminate parasitic high-frequency ringing, along with a 10kΩ pull-down resistor between Gate and Source (Pin 3).
• Heatsink Thermal Management: Always mount the tab securely to an aluminum heatsink using thermal paste; use an insulating mica/silicone pad and shoulder washer if electrical isolation from the Drain is required.
• Snubber Protection: When switching high currents at high frequencies, place an RC snubber network across Drain-Source to suppress turn-off inductive voltage spikes caused by PCB trace inductance.

Datasheet