The Solder Wire Lead Roll 63/37 0.8mm 1Kg is an industrial bulk spool of true eutectic tin-lead alloy soldering wire engineered for continuous factory production lines, high-volume PCB assembly, professional electronic repair stations, and heavy-duty wire harness manufacturing. Formulated with an exact metallurgical ratio of 63% Tin (Sn) and 37% Lead (Pb), it features a sharp, singular eutectic melting transition at exactly 183°C (361°F), completely eliminating the semi-solid "pasty range" during solidification. Centered along its versatile 0.8mm wire gauge is a continuous, high-grade activated rosin flux core that delivers instantaneous surface deoxidation, rapid capillary draw, and mirror-bright, concave solder joints with zero disturbance defects.

Specifications

• Alloy Composition: 63% Tin (Sn) / 37% Lead (Pb) (True Eutectic Formulation)
• Wire Diameter Gauge: 0.8 mm (Approx. 0.031 Inches / Ideal balance for SMD and THT)
• Net Alloy Weight: 1.0 kg (1000 g / ~2.2 lbs excluding spool tare weight)
• Quality Standard: Industrial High Purity (Virgin alloy with uninterrupted flux core continuity)
• Melting Characteristics:
  • Eutectic Melting Point: Exactly 183°C (361°F)
  • Solidus Temperature: 183°C
  • Liquidus Temperature: 183°C
  • Pasty Range: 0°C (Transitions instantly from liquid to solid without intermediate plastic phase)
• Flux Core Type: High-Grade Activated Rosin Core (RA / RMA Type, Non-Corrosive)
• Flux Content / Percentage: 1.8% to 2.2% Core by Weight
• Flux Halide Content: < 0>
• Solder Joint Appearance: Mirror-Bright, Shiny, and Smooth Concave Fillet
• Residue Characteristics: Amber/Clear, Non-Conductive, and Non-Corrosive Rosin Residue
• Spool Construction: Heavy-Duty Industrial Thermoplastic Reel with Wide Flange & Central Arbor
• Spool Dimensions: Approx. 65 mm to 70 mm Flange Diameter × 60 mm to 65 mm Width (Arbor hole: ~19 mm to 20 mm)
• Gross Weight: Approx. 1.10 kg to 1.15 kg (Wire and heavy spool combined)

Features

• True Eutectic Solidification: Freezes instantly upon cooling past 183°C, completely eliminating disturbed or crystalline cold solder joints caused by accidental component vibration on the bench.
• Bulk 1kg Industrial Capacity: Sized specifically for high-throughput assembly benches, automated wire-feeding soldering stations, and busy repair shops, drastically reducing downtime spent swapping empty spools.
• Versatile 0.8mm Diameter: The industry-standard all-rounder gauge that supplies the ideal solder volume per millimeter for through-hole DIP ICs, passive components, terminal blocks, pin headers, and medium SMD footprints (1206/0805).
• Instant Wetting & Capillary Flow: High-purity tin-lead alloy combined with an active rosin core strips surface oxidation from copper pads, brass terminals, and tinned leads in under a second.
• Non-Corrosive High-Impedance Residue: Dries into an inert, non-conductive rosin shield with high surface insulation resistance (SIR), safe to leave on standard commercial boards without fear of trace degradation.
• Low Spatter & Minimal Fuming: Carefully formulated flux core minimizes popping, solder spatter, and micro-balling during rapid thermal contact, keeping surrounding circuit boards clean.

Common Applications

• Industrial PCB Manufacturing: Hand-soldering and secondary touch-up for wave-soldered through-hole assemblies, power boards, and connector arrays.
• High-Volume Electronics Repair & Service: Continuous benchtop maintenance in consumer electronics repair centers, audio equipment restoration, and industrial automation service labs.
• Automated Wire Feeders: Compatible with motorized benchtop solder wire feeders paired with high-frequency induction soldering stations.
• Cable & Wire Harness Assembly: Tinning heavy-gauge stranded conductors, soldering automotive/marine harnesses, and assembling industrial multipin circular connectors.
• Robotics & Power Hardware: Soldering battery discharge leads (XT60, XT90), high-current ESC pads, motor terminals, and power distribution boards.

Usage Tips

• Iron Temperature Calibration:
  • Due to the low eutectic melting point of 183°C, set your soldering iron tip between 300°C and 340°C (572°F to 644°F).
  • Avoid operating above 360°C; excessive heat burns off the rosin core prematurely before it can clean the joint oxides, leaving frosty, dull solder surfaces.
• Proper Soldering Sequence:
  • Touch the tinned iron tip simultaneously to the component lead and the PCB copper pad to heat both parts for 1 to 2 seconds.
  • Feed the 0.8mm solder wire directly into the heated joint—not directly onto the iron tip. Once the solder flows smoothly around the lead to form a shiny concave fillet, withdraw the wire first, then cleanly lift the iron tip away.
• Spool Stand & De-Reeling Setup:
  • Due to the substantial 1kg mass, mount the spool horizontally on a sturdy, bearing-supported benchtop solder reel stand.
  • Pulling directly from an unsupported 1kg roll can bend the wire or cause the heavy spool to tip over and damage benchtop equipment.
• Residue Cleaning (Optional): While the rosin flux residue is non-conductive and chemically non-corrosive under normal operating conditions, clean sensitive RF, high-impedance analog, or high-voltage circuits using an ESD-safe brush and Isopropyl Alcohol (IPA ≥ 99%).
• Health & Environmental Safety:
  • Contains elemental lead (Pb). Always wash hands thoroughly with soap and water after handling solder wire, and never eat or drink near the soldering workbench.
  • Work in a well-ventilated space or use an active benchtop solder fume extractor to pull rosin flux smoke and airborne particulate away from your breathing zone.