The 6x8cm High-Grade FR4 Epoxy Dot Matrix Vero Board (Double-Sided Prototype PCB) is a durable, professional-grade prototyping perfboard designed for hardwiring, assembling, and permanent circuit builds. Constructed from premium flame-retardant fiberglass-reinforced epoxy laminate (FR4) with a thickness of 1.6 mm, it offers vastly superior mechanical rigidity, thermal resistance, and moisture immunity compared to standard paper-phenolic (Bakelite) boards. Featuring a standard 2.54 mm (0.1-inch) grid with individually isolated, through-hole plated copper pads (tinned for easy wetting and oxidation resistance), it enables reliable hand-soldering of through-hole DIP ICs, headers, passives, and discrete semiconductor components for DIY electronics, robotics, and laboratory prototyping.

Specifications

• Product Type: Universal Prototype Perfboard / Dot Matrix Vero Board
• Substrate Material: High-Grade FR4 (Flame-Retardant Glass-Fiber Reinforced Epoxy)
• Board Dimensions: 60 mm × 80 mm (6 × 8 cm)
• Board Thickness: Approx. 1.6 mm (Standard industrial rigid PCB thickness)
• Pad Layout / Pattern: Matrix of Isolated Circular Solder Pads (Dot Matrix)
• Grid Pitch / Spacing: Standard 2.54 mm (0.1 inch) Center-to-Center Hole Pitch
• Hole Diameter: Approx. 1.0 mm (Accepts standard through-hole component leads and 2.54mm pin headers)
• Pad Finish / Plating: Pre-Tinned / HASL (Hot Air Solder Leveling) for smooth, oxidation-free solderability
• Hole Configuration: Plated Through-Hole (PTH) with annular copper rings on both top and bottom layers
• Grid Matrix Count: Approx. 22 × 29 holes (Over 600 independent soldering points)
• Mounting Holes: 4x Corner Mounting Holes (Approx. 3.0 mm / 3.2 mm diameter for M3 standoffs)
• Dielectric Strength: ≥ 30 kV/mm
• Flammability Rating: UL 94V-0 Flame Retardant
• Operating Temperature Range: -40°C to +130°C
• Net Weight: Approx. 14 g

Features

• High-Quality FR4 Epoxy Substrate: Non-warping, mechanically robust, and highly resistant to moisture, high soldering iron temperatures, and mechanical stress compared to brittle Bakelite or synthetic resin boards.
• Pre-Tinned Plated Through-Holes (PTH): Both sides of the board feature copper pads joined through the barrel, preventing pad lifting or delamination during high-temperature or repeated soldering.
• Standard 2.54mm (0.1") Pitch Grid: Fully compatible with DIP microcontrollers, IC sockets, DuPont pin headers, terminal blocks, tactile switches, and discrete axial/radial components.
• Corner Mounting Holes: Includes pre-drilled M3 mounting holes in all four corners for secure standoff attachment inside project enclosures and chassis.
• Clean Point-to-Point Hardwiring: Isolated dot matrix architecture gives you complete freedom to route custom power buses and signal tracks using jumper wires or solder bridges.

Common Applications

• Permanent DIY Circuit Builds: Transitioning temporary solderless breadboard circuits into permanent, vibration-resistant hardware modules.
• Microcontroller Breakout Boards: Custom prototyping shields for Arduino, ESP32, ESP8266, STM32, and Raspberry Pi Pico development boards.
• Power Supply & Regulator Circuits: Mounting linear regulators (LM7805, LM317), bridge rectifiers, filtering capacitors, and DC-DC power routing.
• Robotics & Sensor Interfaces: Building custom sensor interface boards, MOSFET motor switching stages, and relay driver modules.
• Analog & Audio Circuits: Prototyping op-amp filters (NE5532, LM358), preamplifiers, 555 timer pulse generators, and signal conditioning circuits.

Usage Tips

• Creating Solder Bridges: To link adjacent pads into a continuous trace, bend the excess component lead flat along the pads to serve as a conductive spine, then flow solder smoothly along the copper pads and wire.
• Power Distribution Rails: For clean, low-impedance power distribution, designate outer perimeter rows for **$V_{CC}$ (5V/3.3V)** and **Ground (GND)** using solid 22–24 AWG tinned copper bus wire.
• Optimal Soldering Temperature: Set your temperature-controlled soldering iron to **320°C to 350°C** for leaded solder ($60/40$ or $63/37$) or **350°C to 370°C** for lead-free solder. The high-grade FR4 epoxy easily withstands normal dwell times without pad lifting.
• Trimming & Resizing: If a smaller footprint is needed, score the board along a straight edge with an acrylic/PCB carbide scoring knife on both sides, clamp it along the score line, and snap it cleanly. Smooth the cut edge with fine sandpaper.
• Enclosure Mounting: Use M3 nylon or brass hex standoffs in the four corner holes to prevent exposed bottom solder joints from shorting against metallic surfaces or conductive chassis walls.