The Vero Board Dot Epoxy FR4 6x8cm is an industrial-grade, Single sided prototyping circuit board engineered for high-reliability electronics assembly, permanent hardware prototyping, and custom circuit design. Manufactured from military-standard FR4 glass-reinforced epoxy laminate, it delivers superior mechanical stiffness, flame resistance, and thermal endurance compared to low-cost paper-phenolic (bakelite) stripboards. Featuring a standard 2.54 mm (0.1") grid of individual through-hole plated (PTH) circular solder dots with tinned annular rings, it provides high electrical isolation and pad adhesion, making it ideal for point-to-point wiring, microcontrollers, discrete analog circuits, and high-vibration robotics applications.

Specifications

• Board Type: Universal Prototype Matrix Board (Dot Perfboard / Vero Board)
• Base Substrate Material: High-Quality FR4 Glass-Fiber Reinforced Epoxy Laminate
• Flammability Rating: UL94V-0 Flame Retardant
• Board Outline Dimensions: 60.0 mm × 80.0 mm (6 × 8 cm / ~2.36" × 3.15")
• Substrate Thickness: Standard 1.6 mm (±0.1 mm rigid profile)
• Grid Pattern / Pitch: Standard 2.54 mm (0.100 Inches / 100 mil) center-to-center pitch
• Matrix Layout: Individual isolated round solder dots
• Hole Diameter: Approx. 1.0 mm (Accommodates standard DIP IC leads, 20–24 AWG wire, and terminal headers)
• Hole Count: Approx. 22 × 30 holes (660 through-plated tie points)
• Plating / Finish: High-Purity HASL (Hot Air Solder Leveling) Lead-Free or Tin-Plated Copper
• Through-Hole Plating: Full barrel copper plating interconnecting top and bottom annular rings
• Corner Mounting Holes: 4 × Pre-drilled corner mounting holes (~3.0 mm to 3.2 mm diameter for M3 standoffs)
• Dielectric Breakdown Voltage: ≥ 30 kV/mm
• Insulation Resistance: ≥ 1.0 × 10¹² Ω
• Operating Temperature Envelope: -40°C to +130°C (Tg ≥ 130°C to 140°C)
• Net Weight: Approx. 14.5 g to 16.0 g

Features

• High-Strength FR4 Substrate: Unlike brittle phenolic paper boards, this woven glass-epoxy matrix resists cracking, bending, and warping under mechanical stress and vibration.
• Plated-Through-Hole (PTH) Architecture: Copper barrels sleeve every hole, bonding the top and bottom circular pads together; this eliminates lifted pads caused by prolonged soldering iron contact or component rework.
• Independent Isolated Dot Matrix: Every solder pad is electrically isolated from adjacent pads, providing complete circuit flexibility for point-to-point enameled jumper routing without requiring copper strip cutting.
• Pre-Tinned Solder Rings: Solder pads are coated with smooth, oxidation-resistant tin plating that accepts leaded and lead-free solder immediately with rapid wetting and minimal flux splatter.
• Dedicated Corner Mounting Holes: Four symmetrically positioned M3-compatible corner holes allow secure mounting inside project boxes, metal chassis, or 3D-printed enclosures using standard standoffs.

Common Applications

• Permanent Prototype Assembly: Transferring tested solderless breadboard circuits into durable, permanent soldered hardware modules for industrial and field deployment.
• Microcontroller Carrier Boards: Building custom break-out motherboards for Arduino Nano, ESP32 DevKit, STM32 BlackPill, or Raspberry Pi Pico platforms.
• Analog & Power Circuit Prototyping: Assembling linear voltage regulators, op-amp signal conditioners, discrete transistor amplifiers, and audio preamps.
• Robotics & Drone Control Nodes: Hand-wiring custom sensor hubs, power distribution blocks, and relay drive boards subjected to continuous mechanical vibration.
• Educational STEM & University Labs: Hands-on electronics soldering training, student laboratory practicals, and engineering capstone projects.

Usage Tips

• Point-to-Point Wiring Technique:
  • Because each hole is an electrically isolated island, create circuit traces using 30 AWG Kynar wire-wrap wire, fine enameled magnet wire, or bare tinned copper bus wire routed along the underside.
  • Alternatively, bend component lead tails flush against adjacent pads and bridge them with a bead of solder to form short, low-resistance power busses.
• Soldering Temperature & Pad Protection:
  • Set your soldering iron tip to 320°C to 350°C (608°F to 662°F).
  • Although FR4 PTH pads resist heat significantly better than single-sided paper boards, avoid holding the iron tip on a single pad for more than 3 to 4 seconds to maintain substrate bonding integrity.
• Cutting & Sizing:
  • If you need to resize the board, use a carbide PCB guillotine, metal shear, or high-speed rotary cutoff wheel with proper dust extraction.
  • Do not attempt to score and snap FR4 boards with a standard utility knife; the woven glass fibers will splinter, leaving rough, hazardous edges. Always wear an N95 dust mask when cutting or sanding fiberglass.
• Mounting & Clearance:
  • Use nylon or brass M3 standoffs (minimum 6 mm height) beneath the four corner mounting holes.
  • Ensure the underside solder points do not contact metal enclosure panels, chassis plates, or battery covers to avoid catastrophic electrical shorts.
• Cleaning Flux Residue: After finishing all solder joints, scrub the board using a stiff ESD brush soaked in Isopropyl Alcohol (IPA ≥ 99%) to remove sticky rosin residue, leaving a professional, transparent finish.