The Solder Wire Lead Roll 60/40 1mm 100g High Quality (1.0mm Diameter / 100g Spool) is an industry-standard, high-purity electrical soldering alloy engineered for electronics assembly, through-hole PCB component soldering, wire splicing, and general benchtop repair work. Formulated with a classic 60% Tin (Sn) and 40% Lead (Pb) alloy ratio, it features a low melting range (183°C–190°C) with a narrow plastic phase, allowing fast melting, smooth capillary flow, and rapid solidification. Containing an integrated, non-corrosive multi-channel rosin flux core (typically 1.8%–2.2%), it deoxidizes copper traces, component leads, and solder pads on contact to produce bright, shiny, and mechanically robust solder fillets with minimal spatter.

Specifications

• Alloy Composition: 60% Tin (Sn) / 40% Lead (Pb)
• Wire Diameter: 1.0 mm (±0.05 mm)
• Net Weight: 100 g (Spool weight approx. 115 g to 125 g gross)
• Flux Type / Core: Integrated Rosin Activated (RA) / Mildly Activated (RMA) Core
• Flux Content / Percentage: 1.8% to 2.2% (By weight)
• Melting Temperature Range:
  • Solidus: 183°C (361°F)
  • Liquidus: 190°C (374°F)
• Recommended Iron Tip Temperature: 300°C to 350°C (572°F to 662°F)
• Density: Approx. 8.5 g/cm³
• Electrical Conductivity: Approx. 11.5% to 12% IACS
• Residue Characteristics: Light amber, non-conductive, non-corrosive under normal ambient conditions
• Spool Dimensions: Approx. 55 mm Diameter × 28 mm to 30 mm Height
• Spool Hub Hole Diameter: Approx. 20 mm (Standard solder dispenser stand mounting)

Features

• Low Melting Point & Fast Wetting: Melts smoothly at ~185°C, ensuring rapid wetting and flow over copper pads and leads without exposing sensitive components to prolonged heat.
• High-Activity Rosin Core: Continuous internal flux core eliminates the need for external flux on standard copper, tin, and brass surfaces, removing surface oxidation instantly.
• Bright, Shiny Solder Joints: Forms smooth, concave fillets with a bright mirror finish, making visual inspection and defect detection straightforward.
• Optimal 1.0mm Gauge: Versatile diameter suitable for standard through-hole components (DIP ICs, resistors, capacitors), multi-strand hookup wire (18–24 AWG), connectors, and larger PCB pads.
• Low Spatter & Minimal Smoke: Formulated with refined rosin that minimizes flux popping, board discoloration, and excessive fumes during continuous soldering.

Common Applications

• Electronics Assembly & Prototyping: Through-hole PCB soldering for Arduino boards, power supply kits, amplifiers, and DIY modules.
• Wire Harnessing & Cable Splicing: Tinning and joining multi-strand copper wires, automotive wiring harnesses, and battery leads.
• Connector & Header Soldering: Terminating DC barrel jacks, audio connectors, pin headers, terminal blocks, and switch lugs.
• Appliance & Consumer Electronics Repair: Restoring broken solder joints, recapping power supplies, and general board-level troubleshooting.
• Educational & Makerspace Labs: Standard teaching solder alloy for electronics workshops and soldering training.

Usage Tips

• Proper Soldering Iron Temperature: Set your temperature-controlled iron to 320°C–350°C. Excessive heat (>400°C) burns off the rosin flux prematurely before it can clean the joint, resulting in dull, oxidized joints.
• Heating the Joint First (Not the Solder): Touch the iron tip simultaneously to both the component lead and the PCB copper pad for 1–2 seconds to heat them up, then feed the 1.0mm solder wire into the joint—not directly onto the iron tip.
• Post-Solder Cleaning: While the rosin residue is non-conductive and non-corrosive in dry indoor environments, it can attract dust and moisture over time. For professional finishes, clean the PCB using Isopropyl Alcohol (IPA ≥ 99%) and an anti-static brush.
• Health & Safety Precautions:
  • Work in a well-ventilated area or use a solder fume extractor to avoid inhaling rosin smoke.
  • Because this alloy contains lead, wash hands thoroughly with soap and water after handling, and do not eat or drink while soldering.
• Storage: Store in a dry, cool environment away from direct heat and corrosive chemical vapors to keep the outer tin layer bright and prevent flux degradation.